Excel RoHS Compliant

Surface Mount Technology

Since many companies are now realizing the real costs, associated with offshore outsourcing, Excel has created a cost effective alternative for both prototyping and large scale production.
With our cutting edge Fuji line configuration we have flexibility for a high mix environment as well as scalability for ramping up larger production runs

  • Large pin count BGA packages
  • BGA reball and repair
  • uBGA (~.4mm pitch)
  • Leaded devices (~.4mm pitch)
  • Leadless devices
  • Miniature Chip (~0201)
  • All assemblies receive custom thermal profiles
  • Laser cut / custom designed solder stencils